Design And Modeling For 3D LCS And Interposers, 1st Edition

  • Published By: World Scientific Publishing Company
  • ISBN-10: 9814508608
  • ISBN-13: 9789814508605
  • DDC: 621.3815
  • Grade Level Range: College Freshman - College Senior
  • 380 Pages | eBook
  • Original Copyright 2013 | Published/Released December 2014
  • This publication's content originally published in print form: 2013

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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Table of Contents

Front Cover.
Half Title Page.
Other Front Matter.
Title Page.
Copyright Page.
1: System Integration and Modeling Concepts.
2: Modeling of Cylindrical Interconnections.
3: Electrical Modeling of through Silicon Vias.
4: Electrical Performance and Signal Integrity.
5: Power Distribution, Return Path Discontinuities and Thermal Management.
6: Alternate Methods for Power Distribution.
About the Authors.