Comp Microsystems, 1st Edition

  • Published By:
  • ISBN-10: 0444521909
  • ISBN-13: 9780444521903
  • Grade Level Range: College Freshman - College Senior
  • 1903 Pages | eBook
  • Original Copyright 2007 | Published/Released May 2009
  • This publication's content originally published in print form: 2007

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About

Overview

Provides an overview of the wide range of topics which comprise the microsystems field, including, design and materials, fabrication and packaging, optical systems, chemical and biological systems, physical sensors, actuation, electronics for MEMS and industrial applications.

Table of Contents

Front Cover.
Half Title Page.
Title Page.
Copyright Page.
Contents.
Foreword.
Preface.
Editors-in-Chief.
Acknowledgments.
Contributors to Volume 1.
Contents of All Volumes.
Materials.
Silicon and Related Materials.
Compound Semiconductors.
Metals and Alloys.
Polymers.
Biocompatibility of Microsystems.
Harsh Environment Materials.
Fabrication and Packaging.
Wet Etching.
Dry Etching.
Wafer Bonding.
Electrodeposition.
LIGA.
Low-Cost MEMS Technologies.
Micromachining.
Self-Assembly.
Packaging.
Electronics and Systems Design.
Interface Circuits.
Testing, Calibration and Compensation.
Multiphysics and Multiscale Simulation.
Systematic Synthesis Methods.