Advanced Flip Chip Packaging, 1st Edition

  • Published By:
  • ISBN-10: 1441957685
  • ISBN-13: 9781441957689
  • DDC: 621.381046
  • Grade Level Range: College Freshman - College Senior
  • 560 Pages | eBook
  • Original Copyright 2013 | Published/Released June 2014
  • This publication's content originally published in print form: 2013

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Table of Contents

Front Cover.
Half Title Page.
Title Page.
Copyright Page.
1: Market Trends: Past, Present, and Future.
2: Technology Trends: Past, Present, and Future.
3: Bumping Technologies.
4: Flip-Chip Interconnections: Past, Present, and Future.
5: Flip Chip Underfill: Materials, Process, and Reliability.
6: Conductive Adhesives for Flip-Chip Applications.
7: Substrate Technology.
8: IC-Package-System Integration Design.
9: Thermal Management of Flip Chip Packages.
10: Thermo-Mechanical Reliability in Flip-Chip Packages.
11: Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.