eBook Electromigration Modeling at Circuit Layout Level, 1st Edition

  • Published By:
  • ISBN-10: 9814451215
  • ISBN-13: 9789814451215
  • DDC: 621.3815
  • Grade Level Range: College Freshman - College Senior
  • 103 Pages | eBook
  • Original Copyright 2013 | Published/Released May 2014
  • This publication's content originally published in print form: 2013
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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Table of Contents

Front Cover.
Half Title Page.
Title Page.
Copyright Page.
1: Introduction.
2: 3D Circuit Model Construction and Simulation.
3: Comparison of EM Performances in Circuit and Test Structures.
4: Interconnect EM Reliability Modeling at Circuit Layout Level.
5: Concluding Remarks.