eBook Design for Manufacturability, 1st Edition

  • Published By:
  • ISBN-10: 1461417619
  • ISBN-13: 9781461417613
  • DDC: 621.3815
  • Grade Level Range: College Freshman - College Senior
  • 278 Pages | eBook
  • Original Copyright 2014 | Published/Released April 2014
  • This publication's content originally published in print form: 2014
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About

Overview

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Table of Contents

Front Cover.
Half Title Page.
Title Page.
Copyright Page.
About the Author.
Contents.
Preface.
1: Classic DfM: From 2D to 3D.
2: DfM at 28 nm and Beyond.
3: New DfM Domain: Stress Effects.
4: Closure and Future Work.
Appendix.